SMBJ(2021) Datasheet PDF - STMicroelectronics

Description
The SMBJ series are designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2 and MIL STD 883, method 3015, and electrical overstress according to IEC 61000-4-4 and 5. This device is more generally used against surges below 600 W (10/1000 μs).
The Planar technology makes it suitable for high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time.
The SMBJ series are packaged in SMB.

FEATUREs
• Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs)
• Stand-off voltage range from 5 V to 188 V
• Unidirectional and bidirectional types
• Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C
• Operating Tj max: 150 °C
• High power capability at Tj max.: up to 515 W (10/1000 µs)
• Lead finishing: matte tin plating

Complies with the following standards
• UL94, V0
• J-STD-020 MSL level 1
• J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 solderable
   matte tin plated leads
• JESD-201 class 2 whisker test
• IPC7531 footprint
• JEDEC registered package outline
• IEC 61000-4-4 level 4:
   – 4 kV
• IEC 61000-4-2, C = 150 pF - R = 330 Ω exceeds level 4:
   – 30 kV (air discharge)
   – 30 kV (contact discharge)