TQFP Datasheet PDF - STATS ChipPAC, Ltd.
Part Name
TQFP
Description
Other PDF
no available.
PDF
page
2 Pages
File Size
73.6 kB
MFG CO.
STATS ChipPAC, Ltd.
DESCRIPTION
The Thin Profile Quad Flat Pack (TQFP) belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP is the thinnest package in the QFP family. This thin package is made possible by a well controlled low loop wire bonding process and package warpage control during the molding process. TQFP is suitable for mainstream cost sensitive applications where thickness and weight are premium.
FEATURES
• Body Sizes: 7 x 7mm to 14 x 14mm
• Package Height: 1.0mm
• Lead Counts: 32L to 128L
• Lead pitch: 0.80mm to 0.40mm
• Wide range of open tool leadframe and die pad
sizes available
• JEDEC standard compliant
• Lead-free and Green material sets available
APPLICATIONS
• ASIC
• DSP
• Gate Array
• Logic/Microprocessors/Controllers
• Multimedia, PC Chipsets
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