WS128K32N-85H1Q Datasheet PDF - Microsemi Corporation

128Kx32 SRAM MODULE, SMD 5962-93187

FEATURES
■ Access Times of 70, 85, 100, 120ns
■ MIL-STD-883 Compliant Devices Available
■ Packaging
   • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic
      HIP (Package 400).
   • 68 lead, 40mm Low Profile CQFP, 3.56mm (0.140")
      (Package 502).
   • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch)
   square, 4.57mm (0.140 inch) high, (Package 510)
■ Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8
■ Commercial, Industrial and Military Temperature Ranges
■ 5V Power Supply
■ Low Power CMOS
■ TTL Compatible Inputs and Outputs
■ Built in Decoupling Caps and Multiple Ground Pins for Low
   Noise Operation
■ Weight
   • WS128K32-XG2UX - 8 grams typical
   • WS128K32-XH1X - 13 grams typical
   • WS128K32-XG4TX - 20 grams typical
■ Upgradeable to 512Kx32