
Infineon Technologies
EasyPACK™ 2B module with Trench/Fieldstop IGBT H3 and rapid diode and PressFIT / NTC

HIROSE ELECTRIC
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors

HIROSE ELECTRIC
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors

HIROSE ELECTRIC
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors

HIROSE ELECTRIC
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors

HIROSE ELECTRIC
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors

HIROSE ELECTRIC
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors