5962-9750701HXC View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'5962-9750701HXC' PDF : 44 Pages View PDF
Thermal Characteristics
The AD14060/AD14060L is packaged in a 308-lead ceramic
quad flatpack (CQFP). The package is optimized for thermal
conduction through the core (base of the package) down to the
mounting surface. The AD14060/AD14060L is specified for a
case temperature (TCASE). Design of the mounting surface and
attachment material should be such that TCASE is not exceeded.
θJC = 0.36°C/W
Thermal Cross-Section
The data below, together with the detailed mechanical drawings
at the end of the data sheet, allows for constructing simple ther-
mal models for further analysis within targeted systems. The top
layer of the package, where the die are mounted, is a metal VDD
layer. The approximate metal area coverage from the metal
planes and routing layers is estimated below.
AD14060/AD14060L
Thermal Conductivity
Material
Ceramic
Kovar
Tungsten
Thermoplastic
Silicon
Thermal Conductivity
W/cm؇C
0.18
0.14
1.78
0.03
1.45
Layer
VDD
SIG2
SIG3
GND
SIG4
SIG5
BASE
Metal Coverage Per Layer
Percent Metal
(1 Mil Thick)
88
16
14
91
15
13
95
KOVAR LID
0.015 MILS
KOVAR SEAL RING
HEIGHT = 50 MILS
SILICON DIE
19 MILS
THERMOPLASTIC
THICKNESS 5 MILS
VDD
SIG2
SIG3
GND
SIG4
SIG5
BASE
SURFACE
CERAMIC LAYER 28 MILS
CERAMIC LAYER 6 MILS
CERAMIC LAYER 6 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
REV. A
–41–
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