A3986
Dual Full-Bridge MOSFET Driver
with Microstepping Translator
THERMAL CHARACTERISTICS
Characteristic
Symbol
Package Thermal Resistance
RθJA
Test Conditions*
4-layer PCB, based on JEDEC standard
1-layer PCB with copper limited to solder pads
*Additional thermal information available on Allegro Web site.
Value Units
47 ºC/W
114 ºC/W
RESET
STEP
MSx, DIR
tWAKE
t SU
t STEPH
tH
Figure 1. Logic Interface Timing Diagram
tSTEPL
Table 1. Microstep Resolution Truth Table
MS2 MS1
Microstep Resolution
0
0
Full Step
0
1
Half Step
1
0
Quarter Step
1
1
Sixteenth Step
Table 2. Mixed Decay Selection Truth Table
PFD2 PFD1 Percentage of Fast decay
0
0
0% ( ≡ Slow Decay)
0
1
8% (7 cycles)
1
0
26% (23 cycles)
1
1 100% ( ≡ Fast Decay)
Allegro MicroSystems, Inc.
6
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com