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ACS8514T View Datasheet(PDF) - Semtech Corporation

Part Name
Description
MFG CO.
'ACS8514T' PDF : 86 Pages View PDF
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ACS8514 SETS Buddy
ADVANCED COMMS & SENSING FINAL
DATASHEET
Thermal Conditions
The device is rated for full temperature range when this package is used with a 4 layer or more PCB. Copper coverage
must exceed 50%. All pins must be soldered to the PCB. Maximum operating temperature must be reduced when the
device is used with a PCB with less than these requirements.
Figure 21 Typical 100 Pin LQFP Footprint
Notes :
(i) Solderable to this limit.
(ii) Square package - dimensions apply in both X and Y directions.
(iii)Typical example. The user is responsible for ensuring compatibility with PCB manufacturing process, etc.
Revision 3.00 April 2007 © Semtech Corp.
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