ACS8520 SETS
ADVANCED COMMUNICATIONS
Package Information
Figure 29 LQFP Package
FINAL
DATASHEET
D2
D1 1 3
E E1
2
1
3
4
123
A A2
Seating plane
A1 6
A
A
5
e
b
1
AN1
AN2
AN3
Section A-A
R1
S
R2
B
B
AN4
L
L1
b7
Section B-B
c
c1
7
7
b1 7
8
Notes
1 The top package body may be smaller than the bottom package body by as much as 0.15 mm.
2 To be determined at seating plane.
3 Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side.
D1 and E1 are maximum plastic body size dimensions including mold mismatch.
4 Details of pin 1 identifier are optional but will be located within the zone indicated.
5 Exact shape of corners can vary.
6 A1 is defined as the distance from the seating plane to the lowest point of the package body.
7 These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
8 Shows plating.
Table 42 100 Pin LQFP Package Dimension Data (for use with Figure 29)
100 LQFP D/E D1/ A A1 A2 e AN1 AN2 AN3 AN4 R1 R2 L L1 S
Package
E1
Dimensions
in mm
b b1 c c1
Min.
-
- 1.40 0.05 1.35 - 11o 11o 0o 0o 0.08 0.08 0.45 - 0.20 0.17 0.17 0.09 0.09
Nom. 16.00 14.00 1.50 0.10 1.40 0.50 12o 12o - 3.5o -
- 0.60 1.00 - 0.22 0.20 -
-
(ref)
Max.
-
- 1.60 0.15 1.45 - 13o 13o - 7o - 0.20 0.75 -
- 0.27 0.23 0.20 0.16
Revision 3.02/October 2005 © Semtech Corp.
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