ADSP-21362WBBCZ-1A View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADSP-21362WBBCZ-1A' PDF : 52 Pages View PDF
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
10
8
6
Y = 0.0488x - 1.5923
4
2
0
-2
-4
0
50
100
150
200
LOAD CAPACITANCE (pF)
Figure 42. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
THERMAL CHARACTERISTICS
The ADSP-2136x processor is rated for performance over the
temperature range specified in Operating Conditions
on Page 16.
Table 41 and Table 42 airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(BGA). The junction-to-case measurement complies with MIL-
STD-883. All measurements use a 2S2P JEDEC test board.
Industrial applications using the BGA package require thermal
vias, to an embedded ground plane, in the PCB. Refer to JEDEC
standard JESD51-9 for printed circuit board thermal ball land
and thermal via design information.
To determine the junction temperature of the device while on
the application PCB, use:
TJ = TT + (ΨJT × PD)
where:
TJ = junction temperature (°C)
TT = case temperature (°C) measured at the top center of the
package
ΨJT = junction-to-top (of package) characterization parameter
is the typical value from Table 41.
PD = power dissipation (see EE Note No. EE-277 for more
information).
Values of θJA are provided for package comparison and PCB
design considerations.
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Note that the thermal characteristics values provided in
Table 41 and Table 42 are modeled values.
Table 41. Thermal Characteristics for BGA (No thermal vias
in PCB)
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
25.40
21.90
20.90
5.07
0.140
0.330
0.410
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 42. Thermal Characteristics for BGA (Thermal vias in
PCB)
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
23.40
20.00
19.20
5.00
0.130
0.300
0.360
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Rev. A | Page 47 of 52 | December 2006
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