ADSP-21371KSWZ-2A2 View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADSP-21371KSWZ-2A2' PDF : 52 Pages View PDF
PACKAGE DIMENSIONS
The processors are available in a 208-lead RoHS compliant
LQFP_EP package.
ADSP-21371/ADSP-21375
1.60 MAX
0.75
0.60
0.45
208
1.00 REF
1
30.20
30.00 SQ
29.80
SEATING
PLANE
PIN 1
28.10
28.00 SQ
27.90
157
156
157
156
8.712
REF
25.50
REF
208
1
1.45
1.40
1.35
0.15
0.10
0.05
0.08
COPLANARITY
VIEW A
ROTATED 90° CCW
0.20
0.15
0.09
7°
3.5°
0°
52
53
VIEW A
TOP VIEW
(PINS DOWN)
*EXPOSED
PAD
105
104
105
104
BOTTOM VIEW
(PINS UP)
0.27
0.50
0.22
BSC
LEAD PITCH
0.17
COMPLIANT TO JEDEC STANDARDS MS-026-BJB-HD
*NOTE:
THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND THERMALLY CONNECTED TO GND.
THIS SHOULD BE IMPLEMENTED BY SOLDERING THE EXPOSED PAD TO A GND PCB LAND THAT IS THE SAME SIZE
AS THE EXPOSED PAD. THE GND PCB LAND SHOULD BE ROBUSTLY CONNECTED TO THE GND PLANE IN THE PCB
WITH AN ARRAY OF THERMAL VIAS FOR BEST PERFORMANCE.
Figure 41. 208-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP]
(SW-208-1)
Dimensions shown in millimeters
8.890
REF
52
53
Rev. C | Page 51 of 52 | September 2009
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