ADSP-BF537BBCZ-5AV View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADSP-BF537BBCZ-5AV' PDF : 68 Pages View PDF
ADSP-BF534/ADSP-BF536/ADSP-BF537
THERMAL CHARACTERISTICS
To determine the junction temperature on the application
printed circuit board use:
TJ = TCASE + JT PD
where:
TJ = Junction temperature (°C)
TCASE = Case temperature (°C) measured by customer at top
center of package.
JT = From Table 46
PD = Power dissipation (see the power dissipation discussion
and the tables on Page 27 for the method to calculate PD).
Values of JA are provided for package comparison and printed
circuit board design considerations. JA can be used for a first
order approximation of TJ by the equation:
where:
TJ = TA + JA PD
TA = Ambient temperature (°C)
Values of JC are provided for package comparison and printed
circuit board design considerations when an external heat sink
is required. Values of JB are provided for package comparison
and printed circuit board design considerations.
In Table 46 through Table 48, airflow measurements comply
with JEDEC standards JESD51-2 and JESD51-6, and the junc-
tion-to-board measurement complies with JESD51-8. Test
board and thermal via design comply with JEDEC standards
JESD51-9 (BGA). The junction-to-case measurement complies
with MIL-STD-883 (Method 1012.1). All measurements use a
2S2P JEDEC test board.
Industrial applications using the 208-ball BGA package require
thermal vias, to an embedded ground plane, in the PCB. Refer to
JEDEC standard JESD51-9 for printed circuit board thermal
ball land and thermal via design information.
Table 46. Thermal Characteristics (182-Ball BGA)
Parameter
JA
JMA
JMA
JB
JC
JT
JT
JT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
32.80
29.30
28.00
20.10
7.92
0.19
0.35
0.45
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 47. Thermal Characteristics (208-Ball BGA without
Thermal Vias in PCB)
Parameter
JA
JMA
JMA
JB
JC
JT
JT
JT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
23.30
20.20
19.20
13.05
6.92
0.18
0.27
0.32
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 48. Thermal Characteristics (208-Ball BGA with
Thermal Vias in PCB)
Parameter
JA
JMA
JMA
JB
JC
JT
JT
JT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
22.60
19.40
18.40
13.20
6.85
0.16
0.27
0.32
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Rev. J | Page 56 of 68 | February 2014
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