ADSP-BF538F View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADSP-BF538F' PDF : 56 Pages View PDF
Preliminary Technical Data
ADSP-BF538/ADSP-BF538F
SURFACE MOUNT DESIGN
Table 39 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pat-
tern Standard.
Table 39. BGA Data for Use with Surface Mount Design
Package
Solder Mask
Ball Attach Type Opening
Ball Pad Size
316-Ball Mini Ball Grid Array Solder Mask Defined 0.40 mm diameter 0.50 mm diameter
(BC-316)
ORDERING GUIDE
Model 1
Temperature Instruction Flash
Range2
Rate (Max) Memory
ADSP-BF538BBCZ-4A –40ºC to +85ºC 400 MHz NA
ADSP-BF538BBCZ-4F4 –40ºC to +85ºC 400 MHz 512K byte
ADSP-BF538BBCZ-4F8 –40ºC to +85ºC 400 MHz 1M byte
ADSP-BF538BBCZ-5A –40ºC to +85ºC 500 MHz NA
ADSP-BF538BBCZ-5F4 –40ºC to +85ºC 500 MHz 512K byte
ADSP-BF538BBCZ-5F8 –40ºC to +85ºC 500 MHz 1M byte
1 Z = Pb-free part.
2 Referenced temperature is ambient temperature.
Operating Voltage
(Nominal)
Package Description
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
Package
Option
BC-316
BC-316
BC-316
BC-316
BC-316
BC-316
Rev. PrD | Page 55 of 56 | May 2006
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