ASMT-YTC2-0AA02 View Datasheet(PDF) - Avago Technologies
Part Name
Description
MFG CO.
'ASMT-YTC2-0AA02' PDF : 12 Pages View PDF
1.0
1
0.8
0.8
0.6
0.6
0.4
0.4
Red
0.2
Green
Blue
0.0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREE
Red
0.2
Green
Blue
0
-90 -60 -30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREE
Figure 11a. Radiation pattern along x-axis of the package
Figure 11b. Radiation pattern along y-axis of the package
Y
X
X
Y
Figure 11c. Illustration of package axis for radiation pattern
2.30
0.50
4.55 1.35
1.60
0.40
Maximize the size of copper pad of PIN 1, PIN 4, PIN5
for better heat dissipation.
Figure 12. Recommended soldering land pattern
Copper pad
Solder mask
4.00 ±0.10
4.00 ±0.10
2.00 ±0.05
Package Marking
+0.10
∅1.50 0
1.75 ±0.10
3.05 ±0.10
Figure 13. Carrier tape dimensions
7
+0.10
∅1.00 0
3.50 ±0.05
+0.30
8.00 -0.10
2.29 ±0.10
3.81 ±0.10
0.229 ±0.01
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