AT24C128-10PI-1.8 View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT24C128-10PI-1.8' PDF : 23 Pages View PDF
AT24C128/256
AT24C128 Ordering Information(1)
Ordering Code
Package
Operation Range
AT24C128-10PI-2.7
AT24C128N-10SI-2.7
AT24C128W-10SI-2.7
AT24C128-10TI-2.7
8P3
8S1
Industrial Temperature
8S2
(–40°C to 85°C)
8A2
AT24C128-10PI-1.8
AT24C128N-10SI-1.8
AT24C128W-10SI-1.8
AT24C128-10TI-1.8
8P3
8S1
Industrial Temperature
8S2
(–40°C to 85°C)
8A2
AT24C128-10PU-2.7(2)
AT24C128-10PU-1.8(2)
AT24C128N-10SU-2.7(2)
AT24C128N-10SU-1.8(2)
AT24C128W-10SU-2.7(2)
AT24C128W-10SU-1.8(2)
AT24C128-10TU-2.7(2)
AT24C128-10TU-1.8(2)
AT24C128U2-10UU-1.8(2)
AT24C128Y1-10YU-1.8(2)
AT24C128Y4-10YU-1.8(2)
AT24C128-W2.7-11(3)
AT24C128-W1.8-11(3)
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8U2-1
8Y1
8Y4
Die Sale
Die Sale
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
Industrial Temperature
(–40°C to 85°C)
Notes:
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables.
2. “U” designates Green package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
8P3
8S1
8S2
8U2-1
8Y1
8Y4
8A2
–2.7
–1.8
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-ball, die Ball Grid Array Package (dBGA2)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
Options
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 3.6V)
13
0670S–SEEPR–5/06
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