AT24C128-10PI-1.8 View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT24C128-10PI-1.8' PDF : 23 Pages View PDF
AT24C256 Ordering Information(1)
Ordering Code
Package
Operation Range
AT24C256-10PI-2.7
AT24C256N-10SI-2.7
AT24C256W-10SI-2.7
AT24C256-10TI-2.7
8P3
8S1
Industrial Temperature
8S2
(–40°C to 85°C)
8A2
AT24C256-10PI-1.8
AT24C256N-10SI-1.8
AT24C256W-10SI-1.8
AT24C256-10TI-1.8
AT24C256-10PU-2.7(2)
AT24C256-10PU-1.8(2)
AT24C256N-10SU-2.7(2)
AT24C256N-10SU-1.8(2)
AT24C256W-10SU-2.7(2)
AT24C256W-10SU-1.8(2)
AT24C256-10TU-2.7(2)
AT24C256-10TU-1.8(2)
AT24C256U2-10UU-1.8(2)
AT24C256Y1-10YU-1.8(2)
AT24C256Y4-10YU-1.8(2)
AT24C256-W2.7-11(3)
AT24C256-W1.8-11(3)
8P3
8S1
8S2
8A2
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8U2-1
8Y1
8Y4
Die Sale
Die Sale
Industrial Temperature
(–40°C to 85°C)
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
Industrial Temperature
(–40°C to 85°C)
Notes:
1. This device is not recommended for new design. Please refer to AT24C256B datasheet. For 2.7V devices used in the 4.5V to
5.5V range, please refer to performance values in the AC and DC characteristics tables.
2. “U” designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
8P3
8S1
8S2
8U2-1
8Y1
8Y4
8A2
–2.7
–1.8
14
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-ball, die Ball Grid Array Package (dBGA2)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
Options
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 3.6V)
AT24C128/256
0670S–SEEPR–5/06
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