ATSHA204A
Package Drawings
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
Units
Dimension Limits
Number of Terminals
N
Pitch
e
Overall Height
A
Standoff
A1
Terminal Thickness
A3
Overall Length
D
Exposed Pad Length
D2
Overall Width
E
Exposed Pad Width
E2
Terminal Width
b
Terminal Length
L
Terminal-to-Exposed-Pad
K
MILLIMETERS
MIN
NOM
MAX
8
0.50 BSC
0.50
0.55
0.60
0.00
0.02
0.05
0.152 REF
2.00 BSC
1.40
1.50
1.60
3.00 BSC
1.20
1.30
1.40
0.18
0.25
0.30
0.35
0.40
0.45
0.20
-
-
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 2 of 2
© 2017 Microchip Technology Inc.
© 2018 Microchip Technology Inc.
DS40002025A-page 70