CHA2069-QDG21 View Datasheet(PDF) - United Monolithic Semiconductors
Part Name
Description
MFG CO.
'CHA2069-QDG21' PDF : 18 Pages View PDF
18-30GHz Low Noise Amplifier
CHA2069-QDG
(For production, design must be adapted with regard to PCB tolerances and
assembly process)
Basic footprint for a 24L-QFN4x4 (all units mm)
(Please, refer to the UMS propose footprint for optimum
operation in the following “Proposed Assembly board” section)
The RF ports are DC blocked on chip. The DC connection (Vd) does not include any
decoupling capacitor in package, therefore it is mandatory to provide a good external DC
decoupling on the PC board, as close as possible to the package.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0017.
Ref. : DSCHA2069QDG6332 - 28 Nov 06
13/18
Specifications subject to change without notice
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