CHA2296-99F/00 View Datasheet(PDF) - United Monolithic Semiconductors
Part Name
Description
MFG CO.
'CHA2296-99F/00' PDF : 7 Pages View PDF
CHA2296
9-19GHz Buffer Splitter Amplifier
Chip Assembly and Mechanical Data
RF Out 1
To Vd DC Drain supply feed
120pF
RF In
120pF
To Vg DC Gate supply feed
RF Out 2
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended.
Bonding pad positions.
( Chip thickness : 100µm. DC pads : 100*100 µm². All dimensions are in micrometers )
Ref. : DSCHA22962044 13-Feb.-02
6/7
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
Share Link: 
