CHA3093C View Datasheet(PDF) - United Monolithic Semiconductors
Part Name
Description
MFG CO.
'CHA3093C' PDF : 10 Pages View PDF
20-40GHz Medium Power Amplifier
Chip Assembly and Mechanical Data
CHA3093c
Note: Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bonding pad positions
(Chip thickness: 100µm. All dimensions are in micrometers)
Ref. : DSCHA30932158 -07-June-02
9/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
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