CHA5051-QDG View Datasheet(PDF) - United Monolithic Semiconductors
Part Name
Description
MFG CO.
CHA5051-QDG
United Monolithic Semiconductors
'CHA5051-QDG' PDF : 10 Pages View PDF
CHA5051-QDG
7-16GHz Medium Power Amplifier
Proposed assembly board “96270B” for the 24L-QFN4x4 products
characterization.
- Compatible with the proposed footprint.
- Based on typically Ro4003 / 8mils or equivalent.
- Using a microstrip to coplanar transition to access the package.
- Recommended for the implementation of this product on a module board.
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. A typical footprint is proposed for the PCB (motherboard) in the previous
drawing. For the mounting process standard techniques involving solder paste and a suitable
reflow process can be used.
Assembly process
Please refer to application note AN0017
Ordering Information
QFN 4x4 RoHS compliant package:
Stick: XY=20 Tape & reel: XY=21
CHA5051-QDG/XY
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors
S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use
as critical components in life support devices or systems without express written approval from United Monolithic
Semiconductors S.A.S.
Ref. : DSCHA5051-QDG7152 - 01 Jun 07
10/10
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
Share Link: 