CHV2270-98F View Datasheet(PDF) - United Monolithic Semiconductors
Part Name
Description
MFG CO.
CHV2270-98F
United Monolithic Semiconductors
'CHV2270-98F' PDF : 8 Pages View PDF
Ku-band HBT VCO
Chip Mechanical Data and Pin References
5
6
7
8
9
82
355
655
1105
4
CHV2270
10
11
12
13
3
14
2
15
655
1228
1
Origin 0,0
Layout 1310x1980
Unit = µm
External chip size (layout size + dicing streets) = 1380 x 2050 ± 35
Chip thickness = 100 +/- 10
RF Pads (1, 5) = 75 x 100 (SiNx opening larger in the bonding axis)
DC/IF Pads = 75 x 100 (SiNx opening larger in the bonding axis)
SiNx layer protection thickness = 0.2
Pin number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Pin name
RF
SETHP
VA1
VD1
VD2
PRES4
SET4
SET64
PRES64
GLIN
VTF
VTM
VTC
VA2
VTEMP
Description
RF output port
RF power option setting port
Positive supply voltage port (intra-connected to VA2)
Positive supply voltage port (intra-connected to VD2)
Positive supply voltage port (intra-connected to VD1)
Prescaler rank 4 output port
Prescaler rank 4 option setting port
Prescaler rank 64 option setting port
Prescaler rank 64 output port
VTM linearity option setting port
RF Frequency fine tuning port
RF Frequency medium tuning port
RF Frequency coarse tuning port
Positive supply voltage port (intra-connected to VA1)
Temperature sensor output port
Ref. : DSCHV22709030 -30 Jan 09
5/8
Specifications subject to change without notice
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Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
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