CPC7591BA View Datasheet(PDF) - Clare Inc => IXYS
Part Name
Description
MFG CO.
'CPC7591BA' PDF : 19 Pages View PDF
3.2 Printed-Circuit Board Layout
3.2.1 16-Pin SOIC
1.27
(0.050)
3.2.2 16-Pin DFN
0.35
(0.014)
CPC7591
2.00
(0.079)
0.60
(0.024)
9.40
(0.370)
1.05
(0.041)
5.80
(0.228)
DIMENSIONS
mm
(inches)
0.80
(0.031)
DIMENSIONS
mm
(inches)
NOTE: As the metallic pad on the bottom of the DFN
package is connected to the substrate of the die, Clare
recommends that no printed circuit board traces or
vias be placed under this area to prevent unintentional
shorts.
R05
www.clare.com
17
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