CPC7591BA View Datasheet(PDF) - Clare Inc => IXYS
Part Name
Description
MFG CO.
'CPC7591BA' PDF : 19 Pages View PDF
CPC7591
3.3 Tape and Reel Packaging
3.3.1 16-Pin SOIC
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
Embossed
Carrier
Embossment
Pin 1
B0=10.70 + 0.15
(0.421 + 0.01)
Top Cover
Tape
W=16.00 + 0.30
(0.630 + 0.010)
K0=3.20 + 0.15
(0.193 + 0.01)
K =2.70 + 0.15
1
(0.106 + 0.01)
P=12.00
(0.47)
User Direction of Feed
A0=10.90 + 0.15
(0.429 + 0.010)
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
3.3.2 16-Pin DFN
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
Pin 1
B0=7.24 + 0.10
(0.285 + 0.004)
W=16.00 + 0.30
(0.630 + 0.012)
Embossed
Carrier
Embossment
K0=1.61 + 0.10
(0.063 + 0.004)
P=12.00 + 0.10
(0.472 + 0.004)
A0=6.24 + 0.10
(0.246 + 0.004)
User Direction of Feed
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
18
www.clare.com
R05
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