CSR8615 View Datasheet(PDF) - Unspecified
Part Name
Description
MFG CO.
'CSR8615' PDF : 114 Pages View PDF
1.4 PCB Design and Assembly Considerations
This section lists recommendations to achieve maximum board-level reliability of the 8 x 8 x 0.9mm QFN 68-lead
package:
â– NSMD lands (lands smaller than the solder mask aperture) are preferred, because of the greater accuracy
of the metal definition process compared to the solder mask process. With solder mask defined pads, the
overlap of the solder mask on the land creates a step in the solder at the land interface, which can cause
stress concentration and act as a point for crack initiation.
â– CSR recommends that the PCB land pattern is in accordance with IPC standard IPC-7351.
â– Solder paste must be used during the assembly process.
1.5 Typical Solder Reflow Profile
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16,
2013
Pre-production Information
© Cambridge Silicon Radio Limited 2013
Confidential Information - This Material is Subject to CSR's Non-disclosure Agreement
Page 22 of 114
CS-303726-DSP3
www.csr.com
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