CXP973F064 View Datasheet(PDF) - Sony Semiconductor

Part Name

Description

MFG CO.

CXP973F064

CMOS 16-bit Single Chip Microcomputer

Sony Semiconductor 

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Package Outline

Unit: mm

80

81

100PIN QFP (PLASTIC)

23.9 ± 0.4

+ 0.4

20.0 – 0.1

51

50

+ 0.1

0.15 – 0.05

100

1

0.65

+ 0.15

0.3 – 0.1

+ 0.2

0.1 – 0.05

31

30

0.13 M

0.15

A

+ 0.35

2.75 – 0.15

0° to 10°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

QFP-100P-L01

QFP100-P-1420

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

EPOXY RESIN

SOLDER PLATING

LEAD MATERIAL

PACKAGE MASS

42/COPPER ALLOY

1.7g

CXP973F064

– 40 –

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