CY8C20110, CY8C20180
CY8C20160, CY8C20140
CY8C20142
Thermal Impedances
Table 15. Thermal Impedances by Package
16-pin QFN[1]
16-pin SOIC
8-pin SOIC
Package
Solder Reflow Specifications
Table 16. Solder Reflow Specifications
16-pin QFN[1]
16-pin SOIC
8-pin SOIC
Package
Maximum Peak Temperature (TC)
260 C
260 C
260 C
Typical JA[34]
46 °C/W
79.96 °C/W
127.22 °C/W
Maximum Time above TC – 5 °C
30 seconds
30 seconds
30 seconds
Note
34. TJ = TA + Power × JA.
Document Number: 001-54606 Rev. *J
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