DG200BA View Datasheet(PDF) - Harris Semiconductor

Part Name

Description

MFG CO.

DG200BA

CMOS Dual/Quad SPST Analog Switches

Harris Semiconductor 

1 2 3 4 5 6 7 8

Metallization Topology

DIE DIMENSIONS:

94 x 101 x 14 ± 1mils

METALLIZATION:

Type: Al

Thickness: 10kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2/Si3N4

SiO2 Thickness: 7kÅ ± 1.4kÅ

Si3N4 Thickness: 8kÅ ± 1.2kÅ

WORST CASE CURRENT DENSITY:

1 x 105 A/cm2

Metallization Mask Layout

D1

(2)

S1 (3)

DG201

DG201

IN1

IN2

(1)

(16)

D2

(15)

(14) S2

V- (4)

GND (5)

(13) V+ (SUBSTRATE)*

S4 (6)

(7)

D4

(8)

(9)

IN4

IN3

(11) S3

(10)

D3

* Backside of Chip is V+

9-20

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