DPG60IM300PC View Datasheet(PDF) - IXYS CORPORATION
Part Name
Description
MFG CO.
'DPG60IM300PC' PDF : 5 Pages View PDF
Package TO-263 (D2Pak)
Symbol
I RMS
TVJ
T op
Tstg
Weight
Definition
RMS current
virtual junction temperature
operation temperature
storage temperature
Conditions
per terminal 1)
FC
mounting force with clip
1) IRMS is typically limited by the pin-to-chip resistance (1); or by the current capability of the chip (2). In case of (1) and a product
with multiple pins for one chip-potential, the current capability can be increased by connecting the pins as one contact.
DPG60IM300PC
Ratings
min. typ. max. Unit
35 A
-55
175 °C
-55
150 °C
-55
150 °C
2
g
20
60 N
Product Marking
Part No.
Logo
Assembly Line
Date Code
Assembly Code
XXXXXXXXX
IXYS Zyyww
000000
Part number
D = Diode
P = HiPerFRED
G = extreme fast
60 = Current Rating [A]
IM = Single Diode
300 = Reverse Voltage [V]
PC = TO-263AB (D2Pak) (2)
Ordering
Standard
Part Number
DPG60IM300PC
Marking on Product
DPG60IM300PC
Delivery Mode
Tape & Reel
Quantity Code No.
800
502404
Similar Part
DPG60I300HA
Package
TO-247AD (2)
Voltage class
300
Equivalent Circuits for Simulation
I V0
R0
V 0 max
R0 max
threshold voltage
slope resistance *
Fast
Diode
0.69
3.2
* on die level
T VJ = 175 °C
V
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2013 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20131125a
Share Link: 
