DPG60IM300PC View Datasheet(PDF) - IXYS CORPORATION

Part Name

Description

MFG CO.

DPG60IM300PC

HiPerFRED²

IXYS CORPORATION 

1 2 3 4 5

DPG60IM300PC

Outlines TO-263 (D2Pak)

W

A

c2

E

A1

123

Supplier

Option

4

2x e

10.92

(0.430)

c

3x b2

2x b

mm (Inches)

E1

1.78

(0.07)

Dim. Millimeter

min max

Inches

min max

A 4.06 4.83 0.160 0.190

A1 typ. 0.10

typ. 0.004

A2

2.41

0.095

b 0.51 0.99 0.020 0.039

b2 1.14 1.40 0.045 0.055

c 0.40 0.74 0.016 0.029

c2 1.14 1.40 0.045 0.055

D 8.38 9.40 0.330 0.370

D1 8.00 8.89 0.315 0.350

D2

2.5

0.098

E 9.65 10.41 0.380 0.410

E1 6.22 8.50 0.245 0.335

e

2,54 BSC

0,100 BSC

e1

4.28

0.169

H 14.61 15.88 0.575 0.625

L 1.78 2.79 0.070 0.110

L1 1.02 1.68 0.040 0.066

typ.

typ.

W 0.02 0.040 0.0008 0.002

All dimensions conform with

and/or within JEDEC standard.

2.54 (0.100)

Recommended min. foot print

1

2/4

3

IXYS reserves the right to change limits, conditions and dimensions.

© 2013 IXYS all rights reserved

Data according to IEC 60747and per semiconductor unless otherwise specified

20131125a

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