DSA400 View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
'DSA400' PDF : 20 Pages View PDF
DSA400
7.0 SOLDER REFLOW PROFILE
Temperature
260°C
8 minutes max.
217°C
200°C
150°C
25°C
60-180
seconds
Preheat
20-40
seconds
60-150
seconds
Reflow
Cooldown
Time
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
Preheat Time 150°C to 200°C
Time Maintained above 217°C
Peak Temperature
Time within 5°C of Actual Peak
Ramp-Down Rate
Time 25°C to Peak Temperature
3°C/sec. max.
60-180 sec.
60-150 sec.
255°C to 260°C
20-40 sec.
6°C/sec. max.
8 minutes max.
DS20006356A-page 12
2020 Microchip Technology Inc.
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