DSA400 View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
'DSA400' PDF : 20 Pages View PDF
8.0 PACKAGING INFORMATION
8.1 Package Marking Information
20-Lead QFN*
(5.0 mm x 3.2 mm)
XXXXXXXXX
DCPYYWW
0SSS
DSA400
Example
1111Q0019
DCP1907
0K32
Legend:
XX...X
Y
YY
WW
NNN
e3
*
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2020 Microchip Technology Inc.
DS20006356A-page 13
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