EMIF02-1003M6 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF02-1003M6' PDF : 10 Pages View PDF
EMIF02-1003M6
Recommendation on PCB assembly
5
Recommendation on PCB assembly
5.1
Stencil opening design
1. General recommendation on stencil opening design
a) Stencil Opening Dimensions: L (Length), W (Width), T (Thickness).
Figure 13. Stencil opening dimensions
L
TW
b) General Design Rule
Stencil thickness (T) = 75 ~ 125 µm
Aspect Ratio
=
W-----
T
≥
1.5
Aspect Area
=
-------L-----×-----W----------
2T(L + W)
≥
0.66
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
5.2
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed
4. Solder paste with fine particles: powder particle size is 20-45 µm.
7/10
Share Link: 
