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EMIF02-MIC02F1 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
EMIF02-MIC02F1
STMICROELECTRONICS
STMicroelectronics STMICROELECTRONICS
'EMIF02-MIC02F1' PDF : 6 Pages View PDF
1 2 3 4 5 6
®
IPADTM
EMIF02-MIC02F1
2 LINES EMI FILTER
AND ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required :
s Mobile phones and communication systems
s Computers, printers and MCU Boards
DESCRIPTION
The EMIF02-MIC02 is a highly integrated devices
designed to suppress EMI/RFI noise in all systems
subjected to electromagnetic interferences. The EMIF02
flip chip packaging means the package size is equal to the
die size.
This filter includes an ESD protection circuitry which
prevents the device from destruction when subjected to
ESD surges up 15kV.
BENEFITS
s EMI symmetrical (I/O) low-pass filter
s High efficiency in EMI filtering
s Very low PCB space consuming: 1.07mm x 1.57mm
s Very thin package: 0.65 mm
s High efficiency in ESD suppression
s High reliability offered by monolithic integration
s High reducing of parasitic elements through integration
& wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 on input pins
15kV (air discharge)
8 kV (contact discharge)
Level 1 on output pins 2kV (air discharge)
2kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
Flip Chip package
PIN CONFIGURATION (ball side)
32 1
I2 GND I1
A
O2 GND O1
B
BASIC CELL CONFIGURATION
Low-pass Filter
Input
Output
Ri/o = 470
Cline = 16pF
GND
GND
GND
TM : IPAD is a trademark of STMicroelectronics.
September 2003 - Ed: 4A
1/6
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