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EMIF02-MIC03M6 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
'EMIF02-MIC03M6' PDF : 10 Pages View PDF
1 2 3 4 5 6 7 8 9 10
EMIF02-MIC03M6
Recommendation on PCB assembly
4
Recommendation on PCB assembly
4.1
Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 11. Stencil opening dimensions
L
TW
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
Aspect Ratio
=
W-----
T
1.5
Aspect Area
=
-------L-----×----W-----------
2T(L + W)
0.66
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 12. Recommended stencil window position
7 µm
7 µm
15 µm
236 µm
250 µm
15 µm
Footprint
Stencil window
Footprint
Doc ID 14448 Rev 2
7/11
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