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EMIF02-MIC03M6 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
'EMIF02-MIC03M6' PDF : 10 Pages View PDF
1 2 3 4 5 6 7 8 9 10
EMIF02-MIC03M6
Recommendation on PCB assembly
4.5
Reflow profile
Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
125 °C
3°C/s max
3°C/s max
2°C/s62r°°eCCc//ossm6mr°emCacx/eosnmmdmeadxended
0
0
1
2
3
4
5
6
7
10-30 sec
Time (min)
90 to 150 sec
90 sec max
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
Doc ID 14448 Rev 2
9/11
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