EMIF02-MIC06F3 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF02-MIC06F3' PDF : 8 Pages View PDF
Ordering information
EMIF02-MIC06F3
Figure 13. Footprint recommendations Figure 14. Marking
Copper pad Diameter:
220µm recommended
260µm maximum
Solder mask opening:
300µm minimum
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing location
yww = datecode
(y = year
Solder stencil opening :
220µm recommended
xxz
y ww
Figure 15. Flip Chip tape and reel specification
Dot identifying Pin A1 location
2.0
4.0
0.22
Ø 1.55
1.30
4.0
0.69
All dimensions are typical values in mm
User direction of unreeling
4
Ordering information
Note:
Table 3. Ordering information
Order code
Marking
Package
EMIF02-MIC06F3
JB
Flip Chip
Weight
1.8 mg
Base qty
5000
Delivery mode
Tape and reel 7”
More information is available in the application notes
AN2348: “Flip Chip: Package description and recommendations for use”
AN1751: “EMI Filters: Recommendations and measurements”
6/8
Doc ID 15195 Rev 4
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