EMIF02-SPK02F2 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF02-SPK02F2' PDF : 12 Pages View PDF
EMIF02-SPK02F2
3
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 15. Package dimensions
500 µm ± 10
250 µm ± 10
315 µm ± 50
650 µm ± 65
0.89 mm ± 50 µm
Figure 16. Footprint
Copper pad Diameter:
250 µm recommended, 300 µm max.
Solder stencil opening:
330 µm recommended
Solder mask opening recommendation:
340 µm min. for 315 µm copper pad diameter
Figure 17. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
xxz
y ww
Doc ID 15035 Rev 3
9/12
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