EMIF04-EAR01F2 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF04-EAR01F2' PDF : 7 Pages View PDF
Ordering information scheme
2
Ordering information scheme
Figure 8. Ordering information scheme
EMIF04-EAR01F2
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 2: Lead-free, pitch = 500 µm, bump = 310 µm
3
Packaging information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 9. Flip Chip package dimensions
500 µm ± 50
310 µm ± 50
650 µm ± 65
210 µm
1.92mm ± 50 µm
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