EMIF04-EAR01F2 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

EMIF04-EAR01F2

4-line IPAD™, EMI filter and ESD protection

STMicroelectronics 

1 2 3 4 5 6 7

EMIF04-EAR01F2

Figure 10. Footprint recommendations

Copper pad Diameter

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 300 µm copper pad diameter

Packaging information

Figure 11. Marking

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(Y = year

ww = week)

E

xxz

y ww

Figure 12. Flip Chip tape and reel specifications

Dot identifying Pin A1 location

4 ± 0.1

Ø 1.5 ± 0.1

1.56

0.73 ± 0.05

All dimensions in mm

4 ± 0.1

User direction of unreeling

Note:

Note: More information is available in the application note:

AN2348:"Flip Chip: Package description and recommendations for use"

AN1751: “EMI filters: Recommendations and measurements”

5/7

Share Link: