EMIF08-1005M16 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

EMIF08-1005M16

8-line IPAD™ low capacitance EMI filter and ESD protection in micro QFN package

STMicroelectronics 

1 2 3 4 5 6 7 8 9 10

EMIF08-1005M16

Reflow profile

3.5

Reflow profile

Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

250

200

150

100

0.9 °C/s

50

240-245 °C

2 - 3 °C/s

60 sec

(90 max)

-2 °C/s

-3 °C/s

-6 °C/s

Time (s)

0 30 60 90 120 150 180 210 240 270 300

Note:

Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile

corresponds to the latest IPC/JEDEC J-STD-020.

DS4994 - Rev 3

page 10/13

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