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EMIF08-1005M16 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
'EMIF08-1005M16' PDF : 10 Pages View PDF
1 2 3 4 5 6 7 8 9 10
3
Recommendation on PCB assembly
EMIF08-1005M16
Recommendation on PCB assembly
3.1
Stencil opening design
1. General recommendation on stencil opening design
a. Stencil opening dimensions: L (Length), W (Width), T (Thickness).
2. General design rule
a. Stencil thickness (T) = 75 ~ 125 μm
b.
Aspect
ratio
=
W
T
1.5
c.
Aspect
area
=
L×W
2T L + W
0.66
3. Reference design
a. Stencil opening thickness: 100 μm
b. Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 12. Recommended stencil window position
L
TW
DS4994 - Rev 3
page 8/13
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