EMIF09-SD01F3 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF09-SD01F3' PDF : 9 Pages View PDF
Characteristics
1
Characteristics
Figure 2.
DAT3_PU
Device configuration
EMIF09-SD01F3
VSD
CLK
CMD
DATA0
DATA1
DATA2
DATA3
CD
WP
WP+CD
DAT3_PD
R21
R1
R2
R3
R4
R5
R6
R7
R8
R9
SDCLK
SDCMD
SDDATA0
SDDATA1
SDDATA2
SDDATA3
SDCD
SDWP
SDWP+CD
GND_H
GND_C
Table 1. Pin-signal attribution
Pin Description Pin Description Pin Description Pin Description Pin Description
A1 DATA2
B1 CD
C1 DAT3_PD D1 WP+CD
E1 DATA1
A2 DATA3
B2 CMD
C2 WP
D2 CLK
E2 DATA0
A3 GND_H
A4 SDDATA2
B3
B4 SDCD
C3 DAT3_PU
C4 SDWP
D3 GND_C
E3 GND_C
D4 SDWP+CD E4 SDDATA1
A5 SDDATA3 B5 SDCMD
C5 VSD
D5 SDCLK
E5 SDDATA0
Table 2. Absolute ratings (limiting values)
Symbol
Parameter
Value
Unit
Internal pins (A1, B1, C1, D1, E1, A2, B2, C2, D2, E2, C3)
ESD discharge IEC 61000-4-2, air discharge
2
ESD discharge IEC 61000-4-2, contact discharge
2
VPP
External pins (A4, B4, C4, D4, E4, A5, B5, C5, D5, E5)
kV
ESD discharge IEC 61000-4-2, air discharge
15
ESD discharge IEC 61000-4-2, contact discharge
8
Tj
Junction temperature
Top
Operating temperature range
Tstg
Storage temperature range
125
°C
-30 to + 85
°C
-55 to 150
°C
GND bumps (GND_H and GND_C - A3, D3 and E3) must be connected to ground on the
printed circuit board for ESD testing and RF measurements.
2/9
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