EMIF09-SD01F3 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

EMIF09-SD01F3

9-line IPAD™, EMI filter and ESD protection

STMicroelectronics 

1 2 3 4 5 6 7 8 9

EMIF09-SD01F3

Figure 13. Footprint

Copper pad Diameter:

220 µm recommended

260 µm maximum

Solder mask opening:

300 µm minimum

Solder stencil opening :

220 µm recommended

Ordering information

Figure 14. Marking

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

E

xxz

y ww

Figure 15. Flip Chip tape and reel specifications

Dot identifying Pin A1 location

4 ± 0.1

Ø 1.5 ± 0.1

2.11

0.69 ± 0.05

4 ± 0.1

Note:

All dimensions in mm

User direction of unreeling

More information is available in the application note:

AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and

recommendation for use”

AN1751: EMI Filters: Recommendations and measurements

5

Ordering information

Table 4. Ordering information

Order code

Marking

EMIF09-SD01F3

GZ

Package

Flip Chip

Weight

5.2 mg

Base qty Delivery mode

5000 Tape and reel (7”)

7/9

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