EMIF10-COM01 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF10-COM01' PDF : 5 Pages View PDF
EMIF10-COM01
APLAC MODEL
in
MODEL = demif10
200R
sub
out
MODEL = demif10
Demif10 model
BV = 7
IBV = 1m
CJO = 25p
M = 0.3333
RS = 1
VJ = 0.6
TT = 100n
PCB grounding recommendations
In order to ensure a good efficiency in terms of ESD protection and filtering behavior, we recommend to
implement microvias (100 µm dia.) between the GND bumps and the GND layer. GND bumps can be
connected together in PCB layer 1, and in addition, if possible, use through hole vias (200 um dia.) in both
sides of filter to improve contact to GND (layer). This layout will minimize the distance to the ground and
thus parasitic inductances. In addition, we recommend to have GND plane wherever possible.
ORDERING CODE
EMIF 10 - COM 01
EMI Filter
Nb of lines
Version
For communication
4/5
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