EMIF10-COM01 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF10-COM01' PDF : 5 Pages View PDF
EMIF10-COM01
PACKAGE MECHANICAL DATA
DIE SIZE
500
All dimensions in µm
2640
MARKING
300
s Die size: (2640 ± 50) x (2640 ± 50)
s Die height (including bumps): 650 ± 65
s Bump diameter: 315 ± 50
s Pitch: 500 ± 50
s Weight: 9.3mg
®
diam 400
FET
Y WW
2640
s Y W W: Date code
PACKING:
EMIF10-COM01 is delivered in Tape & Reel (7 inches reel); one Tape & Reel contains 5000 dice.
Note: More packing information are available in the application note AN1235: "Flip-Chip package description and recom-
mendations for use"
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany
Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore
Spain - Sweden - Switzerland - United Kingdom - United States.
http://www.st.com
5/5
Share Link: 
