ESDALC6V1W5 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'ESDALC6V1W5' PDF : 7 Pages View PDF
ESDALC6V1W5
3 Package mechanical data
3 Package mechanical data
3.1 SOT323-5L package
E
b
Q1
c
HE
DIMENSIONS
A
REF.
Millimeters
Inches
e
D
e
A1
A2
Min. Max. Min. Max.
A
0.8
1.1 0.031 0.043
A1
0
0.1
0
0.004
A2
0.8
1
0.031 0.039
b
0.15
0.3 0.006 0.012
c
0.1
0.18 0.004 0.007
D
1.8
2.2 0.071 0.086
E
1.15 1.35 0.045 0.053
e
0.65 Typ.
0.025 Typ.
HE
1.8
2.4 0.071 0.094
Q1
0.1
0.4 0.004 0.016
Figure 8. Footprint dimensions
0.3
1.0
2.9
1.0
0.35
Dimensions in mm
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com.
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