EVAL-AD5541ASDZ View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'EVAL-AD5541ASDZ' PDF : 20 Pages View PDF
AD5541A
Data Sheet
REF 1
CS 2
SCLK 3
DIN 4
AD5541A-1
TOP VIEW
(Not to Scale)
8 GND
7 VDD
6 VOUT
5 CLR
NOTES
1. FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE SUBSTRATE, GND.
Figure 5. AD5541A-1 8-Lead LFCSP Pin Configuration
VDD 1
VOUT 2
AGND 3
REF 4
CS 5
AD5541A
TOP VIEW
(Not to Scale)
10 VLOGIC
9 DGND
8 LDAC
7 DIN
6 SCLK
NOTES
1. FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE SUBSTRATE, GND.
Figure 6. AD5541A 10-Lead LFCSP Pin Configuration
Table 7. AD5541A-1 and AD5541A Pin Function Descriptions
Pin No.
8-Lead LFCSP 10-Lead LFCSP Mnemonic Description
1
4
2
5
REF
Voltage Reference Input for the DAC. Connect to an external 2.5 V reference. The
reference can range from 2 V to VDD.
CS
Logic Input Signal. The chip select signal is used to frame the serial data input.
3
6
SCLK
Clock Input. Data is clocked into the serial input register on the rising edge of SCLK.
Duty cycle must be between 40% and 60%.
4
7
DIN
Serial Data Input. This device accepts 16-bit words. Data is clocked into the serial input
register on the rising edge of SCLK.
5
N/A1
CLR
Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all
LDAC pulses are ignored. When CLR is activated, the serial input register and the DAC
register are cleared to zero scale.
6
2
N/A1
9
VOUT
DGND
Analog Output Voltage from the DAC.
Digital Ground. Ground reference for digital circuitry.
7
1
VDD
Analog Supply Voltage.
8
N/A1
GND
Ground Reference Point for Both Analog and Digital Circuitry.
N/A1
3
AGND
Ground Reference Point for Analog Circuitry.
N/A1
10
N/A1
8
VLOGIC
LDAC
Logic Power Supply.
LDAC Input. When this input is taken low, the DAC register is simultaneously updated
with the contents of the serial input register.
EPAD
Exposed Pad. For increased reliability of the solder joints and maximum thermal
capability, it is recommended that the pad be soldered to the substrate, GND.
1 N/A means not applicable.
Rev. B | Page 8 of 20
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