Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
VDD to GND
Digital Input Voltage to GND
VOUT to GND
VREFIN/VREFOUT to GND
Operating Temperature Range
Industrial
Storage Temperature Range
Junction Temperature (TJ MAX)
Reflow Soldering Peak Temperature
Pb Free
Rating
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +105°C
−65°C to +150°C
150°C
260°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
AD5628/AD5648/AD5668
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 6. Thermal Resistance
Package Type
θJA
θJC
RU-141
121
35
RU-161
113.5 35
CP-16-172
50.6
30
CB-16-161
45
Unit
°C/W
°C/W
°C/W
°C/W
1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test
board. See JEDEC JESD51.
2 Thermal impedance simulated values are based on JEDEC 2S2P thermal test
board with nine thermal vias. See JEDEC JESD51.
ESD CAUTION
Rev. J | Page 9 of 30