EVAL-AD7264EDZ View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
EVAL-AD7264EDZ
Analog Devices
'EVAL-AD7264EDZ' PDF : 30 Pages View PDF
AD7264
OUTLINE DIMENSIONS
7.00
BSC SQ
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
37
36
0.30
0.23
0.18
48
1
PIN 1
INDICATOR
TOP
VIEW
6.75
BSC SQ
EXPOSED
PAD
(BOTTOM VIEW)
5.25
5.10 SQ
4.95
1.00 12° MAX
0.85
0.80
SEATING
PLANE
0.50
0.40
25
0.30
24
0.80 MAX
0.65 TYP
0.50 BSC
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
12
13
0.25 MIN
5.50
REF
THE EXPOSED METAL PADDLE ON THE
BOTTOM OF THE LFCSP PACKAGE
MUST BE SOLDERED TO PCB GROUND
FOR PROPER HEAT DISSIPATION AND
ALSO FOR NOISE AND MECHANICAL
STRENGTH BENEFITS.
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
Figure 37. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad
(CP-48-1)
Dimensions shown in millimeters
0.75
0.60
0.45
1.60
MAX
48
1
9.20
9.00 SQ
8.80
PIN 1
1.45
1.40
1.35
0.15
0.05
SE ATING
PLANE
0.20
0.09
7°
3.5°
0°
0.08
COPLANARITY
VIEW A
ROTATED 90° CCW
TOP VIEW
(PINS DOWN)
12
13
VIEW A 0.50
BSC
LEAD PITCH
COMPLIANT TO JEDEC STANDARDS MS-026-BBC
Figure 38. 48-Lead Low Profile Quad Flat Package [LQFP]
(ST-48)
Dimensions shown in millimeters
37
36
7.20
7.00 SQ
6.80
25
24
0.27
0.22
0.17
Rev. A | Page 28 of 32
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