Data Sheet
AD7982
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
REF 1
VDD 2
IN+ 3
IN– 4
GND 5
10 VIO
AD7982
TOP VIEW
(Not to Scale)
9 SDI
8 SCK
7 SDO
6 CNV
Figure 3. 10-Lead MSOP Pin Configuration
REF 1
VDD 2
IN+ 3
IN– 4
GND 5
AD7982
TOP VIEW
(Not to Scale)
10 VIO
9 SDI
8 SCK
7 SDO
6 CNV
NOTES
1. EXPOSED PAD. FOR THE LEAD FRAME CHIP SCALE
PACKAGE (LFCSP), THE EXPOSED PAD MUST BE
CONNECTED TO GND. THIS CONNECTION IS NOT
REQUIRED TO MEET THE ELECTRICAL
PERFORMANCES.
Figure 4. 10-Lead LFCSP Pin Configuration
Table 8. Pin Function Descriptions
Pin
No. Mnemonic Type1 Description
1 REF
AI
Reference Input Voltage. The REF range is 2.4 V to 5.1 V. This pin is referred to the GND pin and must be
decoupled closely to the GND pin with a 10 μF capacitor.
2 VDD
P
Power Supply.
3 IN+
AI
Differential Positive Analog Input.
4 IN−
AI
Differential Negative Analog Input.
5 GND
P
Power Supply Ground.
6 CNV
DI
Convert Input. This input has multiple functions. On its leading edge, it initiates the conversions and selects
the interface mode of the device: chain mode or CS mode. In CS mode, the SDO pin is enabled when CNV is
low. In chain mode, the data must be read when CNV is high.
7 SDO
DO Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK.
8 SCK
DI
Serial Data Clock Input. When the device is selected, the conversion result is shifted out by this clock.
9 SDI
DI
Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC as follows:
Chain mode is selected if SDI is low during the CNV rising edge. In this mode, SDI is a data input that
daisy-chains the conversion results of two or more ADCs onto a single SDO line. The digital data level on SDI
is the output on SDO with a delay of 18 SCK cycles.
CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable the
serial output signals when low. If SDI or CNV is low when the conversion is complete, the busy indicator
feature is enabled.
10 VIO
P
Input/Output Interface Digital Power. Nominally at the same supply as the host interface (1.8 V, 2.5 V, 3 V, or 5 V).
EPAD
Exposed Pad. For the lead frame chip scale package (LFCSP), the exposed pad must be connected to GND.
This connection is not required to meet the electrical performances.
1AI means analog input, DI means digital input, DO means digital output, and P means power.
Rev. E | Page 9 of 26